![]() Journal of Verification, Validation and Uncertainty Quantificationįor the purpose of enhancing the solder joint reliability of a wafer level chip scaling package (WLCSP), the WLCSP adopted the familiar design structure where both the stress compliant layer with low elastic modulus and the dummy solder joints are considered as structural supports.Journal of Thermal Science and Engineering Applications.Journal of Offshore Mechanics and Arctic Engineering.Journal of Nuclear Engineering and Radiation Science.Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems.Journal of Nanotechnology in Engineering and Medicine.Journal of Micro and Nano-Manufacturing.Journal of Manufacturing Science and Engineering.Journal of Engineering Materials and Technology.Journal of Engineering for Sustainable Buildings and Cities.Journal of Engineering for Gas Turbines and Power.Journal of Engineering and Science in Medical Diagnostics and Therapy.Journal of Electrochemical Energy Conversion and Storage.Journal of Dynamic Systems, Measurement, and Control.Journal of Computing and Information Science in Engineering. ![]()
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